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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 期刊收藏夹

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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊基本信息Hello,您是该期刊的第348470位访客


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期刊名字MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSINGMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

MAT SCI SEMICON PROC
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
7.6
102人评分
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声誉
8.0

影响力
6.8

速度
8.8

期刊ISSN1369-8001
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2025-2026最新IF
(数据来源于网友提供)
注册登录后,查看IF
实时影响因子 截止2026年5月06日:5.23
2025-2026自引率3.8%点击查看自引率趋势图
五年IF
(数据来源于网友提供)
4.602数据由网友[fasteagle510]收集提供
h-index 49
CiteScore
2026年6月最新版
CiteScoreSJRSNIPCiteScore排名
8.700.7671.069
学科分区排名百分位
大类:Engineering
小类:Mechanical Engineering
Q193 / 740
大类:Engineering
小类:Condensed Matter Physics
Q157 / 446
大类:Engineering
小类:Mechanics of Materials
Q162 / 408
大类:Engineering
小类:General Materials Science
Q1103 / 475

期刊简介
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
期刊官方网站https://www.journals.elsevier.com/materials-science-in-semiconductor-processing
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期刊投稿网址https://www.editorialmanager.com/MSSP
稿件规范性与完整性预检 开始检查>>
该期刊中国学者近期发文 - NewLow-LOD organic thin-film NO2 gas sensor based on a porous polystyrene structure
Author: Lu, Xi; Wang, Baijin; Cui, Ziyang; Kelimu, Kaicaiayi; Wang, Lu; Wang, Lijuan
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110785


Advances on the application of ceria nanoparticles in dielectric layer CMP and post-cleaning: structural control, modification strategies, and mechanistic studies
Author: Qi, Wenyue; Geng, Jiaji; Tan, Baimei; Wang, Fangyuan; Zhao, Xinyu; Zhao, Jiadong
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110767


2D hBN tunneling-contact BP avalanche transistor
Author: Li, Le; Yang, Sanjun; Zhou, Shuheng; Hua, Xianglun; Cheng, Gang; Zhou, Peng; Du, Zuliang
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110712


Ablation characteristic of single-crystal diamond by femtosecond laser processing
Author: Feng, Jiecai; Wang, Junzhe; Liu, Hongfei; Li, Cheng; Zhang, Yilian; Dong, Xiaohao; Zhang, Zengyan; Sun, Yanning; Tian, Yingzhong
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110774


期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING的语言要求,还能让MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评(1篇) 论文致谢
提交文稿
是否OA开放访问No
通讯方式ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
出版商Elsevier Ltd
涉及的研究方向工程技术-材料科学:综合
出版国家或地区ENGLAND
出版语言English
出版周期Bimonthly
出版年份0
年文章数 967点击查看年文章数趋势图
Gold OA文章占比10.45%
研究类文章占比:
文章 ÷(文章 + 综述)
94.73%
期刊分区表预警名单 2026年03月发布的新锐学术版:不在预警名单中

2025年03月发布的2025版:不在预警名单中

2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
《新锐期刊分区表》
2026年3月发布
点击查看期刊分区表趋势图
大类学科小类学科Top期刊综述期刊
材料科学 1区3区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区1区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
4区1区3区
PHYSICS, APPLIED
物理:应用
2区4区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区1区3区
N/A
期刊分区表
2025年3月升级版
大类学科小类学科Top期刊综述期刊
材料科学 4区3区2区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区1区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区1区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
4区3区3区
PHYSICS, APPLIED
物理:应用
2区3区3区
期刊分区表
2023年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 3区3区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
1区1区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
2区2区3区
PHYSICS, APPLIED
物理:应用
4区2区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区3区3区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
平均审稿速度网友分享经验:
平均1.7个月
来源Elsevier官网:
平均3.7周
平均录用比例网友分享经验:
约88.33%
来源Elsevier官网:
15%
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING顺利发表。
快看看作者怎么说吧:服务好评(1篇) 论文致谢
提交文稿
在线出版周期来源Elsevier官网:
平均4.1周
期刊常用信息链接
同领域相关期刊 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊分区表趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 期刊分区表趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发文
  • 期刊分区表相关期刊
  • 同类著名期刊名称 h-index CiteScore
    PROGRESS IN MATERIALS SCIENCE14475.50
    NATURE MATERIALS40356.90
    Nature Nanotechnology28657.80
    ADVANCED MATERIALS44742.00
    Materials Today13827.00
    MATERIALS SCIENCE & ENGINEERING R-REPORTS12921.30
    ADVANCED FUNCTIONAL MATERIALS26928.70
    ACS Nano31023.10
    INTERNATIONAL MATERIALS REVIEWS9547.30
    Journal of Materials Science & Technology5129.90
    期刊分区表同大类学科的热搜期刊 浏览次数
    Chemical Engineering Journal4947599
    ACS Applied Materials & Interfaces4397075
    APPLIED SURFACE SCIENCE3242203
    Journal of Alloys and Compounds3022305
    ADVANCED MATERIALS2196492
    ADVANCED FUNCTIONAL MATERIALS2022916
    Journal of Materials Chemistry A1933839
    JOURNAL OF MATERIALS SCIENCE1904150
    Ceramics International1843885
    ACS Nano1764166
  •  

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
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  • 中国学者近期发表的论文
    1.Low-LOD organic thin-film NO2 gas sensor based on a porous polystyrene structure

    Author: Lu, Xi; Wang, Baijin; Cui, Ziyang; Kelimu, Kaicaiayi; Wang, Lu; Wang, Lijuan
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110785
        DOI
    2.Advances on the application of ceria nanoparticles in dielectric layer CMP and post-cleaning: structural control, modification strategies, and mechanistic studies

    Author: Qi, Wenyue; Geng, Jiaji; Tan, Baimei; Wang, Fangyuan; Zhao, Xinyu; Zhao, Jiadong
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110767
        DOI
    3.2D hBN tunneling-contact BP avalanche transistor

    Author: Li, Le; Yang, Sanjun; Zhou, Shuheng; Hua, Xianglun; Cheng, Gang; Zhou, Peng; Du, Zuliang
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110712
        DOI
    4.Ablation characteristic of single-crystal diamond by femtosecond laser processing

    Author: Feng, Jiecai; Wang, Junzhe; Liu, Hongfei; Li, Cheng; Zhang, Yilian; Dong, Xiaohao; Zhang, Zengyan; Sun, Yanning; Tian, Yingzhong
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110774
        DOI
    5.Growth of BiOCl nanoneedles on in-situ C-doped TiO2 nanobelts for enhanced photocatalytic degradation of tetracycline antibiotics in visible light

    Author: Bao, Sarenqiqige; Liang, Haiou; Bai, Jie
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110775
        DOI
    6.A nano-mechanical study of elastic-plastic deformation and brittle fracture competition in InSb wafers

    Author: Zhang, Min; Chen, Qian; Chen, Xi; Wen, Xin; Dai, Junhui; Song, Dexiong; Wang, Rongfei; Lin, Feng; Wang, Chong; Qiu, Feng; Han, Jiaxian; Yang, Chunliu; Li, Fangyan; Wei, Hua; Liu, Hanbao; Liu, Tinglong; Pu, Shikun; Hui, Feng; Chen, Jiancai; He, Wenjin; Yang, Jie
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110760
        DOI
    7.Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging

    Author: Sun, Guoli; Liu, Jinhong; Zhao, Jingyi; Zhang, Jialin; Li, Zhaoyu; Zhang, Shuye
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110777
        DOI
    8.The surface removal mechanism of laser structured SiC surface under self-rotating grinding process

    Author: Chen, Pei; Zhou, Jie; Liu, Jingbo; Pan, Rui; Qin, Fei
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110754
        DOI
    9.Waste-to-energy storage: Recycling electrode materials for supercapacitors

    Author: Alduhaish, Osamah; Reddy, Nandarapu Purushotham; Ramachandran, Tholkappiyan; Kumar, Yedluri Anil; Naushad, M.; Hui, Kwun Nam; Ghosh, Avijit; Ravindran, Ezhakudiyan; Maity, Arjun
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110757
        DOI
    10.Resistive switching characteristics and ultraviolet photoelectric response based on the p-CuO/n-ZnO heterojunction interface

    Author: Jia, Jiqiang; Xiao, Yixiong; Mi, Tianjian; Yan, Fuxue
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2026; Vol. 212, Issue , pp. -. DOI: 10.1016/j.mssp.2026.110797
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Reviews Materials61110.60
    Nature Energy6178.40
    eScience063.40
    Electrochemical Energy Reviews057.00
    PROGRESS IN MATERIALS SCIENCE14475.50
    Nano-Micro Letters2758.90
    NATURE MATERIALS40356.90
    Nature Nanotechnology28657.80
    Joule050.40
    Energy & Environmental Science27942.60
    同分区等级的其他期刊名称 h-index CiteScore
    Foundations and Trends in Computer Graphics and Vision032.80
    PROGRESS IN REACTION KINETICS AND MECHANISM2321.60
    Journal of Obesity & Metabolic Syndrome014.40
    Advanced Sensor and Energy Materials03.70
    Business & Information Systems Engineering018.50
    Business & Information Systems Engineering018.50
    Battery Energy015.10
    JOURNAL OF THE RENIN-ANGIOTENSIN-ALDOSTERONE SYSTEM425.50
    PROGRESS IN PHOTOVOLTAICS11518.50
    Degenerative Neurological and Neuromuscular Disease00.00
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